Volume 43 Issue 9
Sep.  2017
Turn off MathJax
Article Contents
ZHANG Jianhua, XIA Yong, DING Li, et al. Sputtering model of SiO2 for low energy Ar+ and Xe+ bombardment[J]. Journal of Beijing University of Aeronautics and Astronautics, 2017, 43(9): 1766-1772. doi: 10.13700/j.bh.1001-5965.2016.0744(in Chinese)
Citation: ZHANG Jianhua, XIA Yong, DING Li, et al. Sputtering model of SiO2 for low energy Ar+ and Xe+ bombardment[J]. Journal of Beijing University of Aeronautics and Astronautics, 2017, 43(9): 1766-1772. doi: 10.13700/j.bh.1001-5965.2016.0744(in Chinese)

Sputtering model of SiO2 for low energy Ar+ and Xe+ bombardment

doi: 10.13700/j.bh.1001-5965.2016.0744
More Information
  • Corresponding author: ZHANG Jianhua, E-mail:zjh@cqjj8.com
  • Received Date: 18 Sep 2016
  • Accepted Date: 28 Oct 2016
  • Publish Date: 20 Sep 2017
  • In order to obtain the more accurate sputtering model of SiO2 for bombardment with low energy Ar+ and Xe+, three existing models, Pencil model, Bach model and Seah model, were investigated and the deficiencies were analyzed. On the basis of Seah model, the sputtering parameters and surface binding energy were calculated by equivalent atomic method. Meanwhile, a new calculation method of sputtering threshold was applied to form a new advanced model. Combined with the experimental data of SiO2 for bombardment at normal incidence with Ar+ and Xe+, the calculation results of the four models were contrastively analyzed. The results show that, for both Ar+ and Xe+ bombardment, the root mean square error of the new advanced model is the smallest and the goodness of fit is the largest, which means the new advanced model is better than other three models. Under the low energy condition, the new advanced model can calculate the sputtering yield of SiO2 bombarded by Ar+ and Xe+ more accurately.

     

  • loading
  • [1]
    SIGMUND P.Theory of sputtering.I:Sputtering yield of amorphous and polycrystalline targets[J].Physical Review, 1969, 184(2):383-416. doi: 10.1103/PhysRev.184.383
    [2]
    计京津. 稀薄等离子体羽流的溅射效应研究[D]. 上海: 上海交通大学, 2011: 3-9.

    JI J J.Study of rarefied plasma plume sputtering effect[D].Shanghai:Shanghai Jiao Tong University, 2011:3-9(in Chinese).
    [3]
    BOYD I D, FALK M L.A review of spacecraft material sputtering by Hall thruster plumes:AIAA-2001-3353[R].Reston:AIAA, 2001.
    [4]
    SEAH M P, NUNNEY T S.Sputtering yields of compounds using argon ions[J].Journal of Physics D:Applied Physics, 2010, 43(25):253001. doi: 10.1088/0022-3727/43/25/253001
    [5]
    BOHDANSKY J, ROTH J, BAY H L.An analytical formula and important parameters for low-energy ion sputtering[J].Journal of Applied Physics, 1980, 51(5):2861-2865. doi: 10.1063/1.327954
    [6]
    KELLY R, LAM N Q.The sputtering of oxides.Part I:A survey of the experimental results[J].Radiation Effects, 1973, 19(1):39-48. doi: 10.1080/00337577308232213
    [7]
    PENCIL E J, RANDOLPH T, MANZELLA D H.End-of-life stationary plasma thruster far-field plume characterization:AIAA-1996-2709[R].Reston:AIAA, 1996.
    [8]
    YAMAMURA Y, TAWARA H.Energy dependence of ion-induced sputtering yields from monatomic solids at normal incidence[J].Atomic Data and Nuclear Data Tables, 1996, 62(2):149-253. doi: 10.1006/adnd.1996.0005
    [9]
    ROSENBERG D, WEHNER G K.Sputtering yields for low energy He+, Kr+, and Xe+ ion bombardment[J].Journal of Applied Physics, 1962, 33(5):1842-1845. doi: 10.1063/1.1728843
    [10]
    BACH H.Ion beam sputtering of silicate glasses and oxides[J].Journal of Non-Crystalline Solids, 1988, 102(1):36-42.
    [11]
    SEAH M P, CLIFFORD C A, GREEN F M, et al.An accurate semi-empirical equation for sputtering yields.I:For argon ions[J].Surface and Interface Analysis, 2005, 37(5):444-458. doi: 10.1002/(ISSN)1096-9918
    [12]
    MATSUNAMI N, YAMAMURA Y, ITIKAWA Y, et al.Energy dependence of the ion-induced sputtering yields of monatomic solids[J].Atomic Data and Nuclear Data Tables, 1984, 31(1):1-80. doi: 10.1016/0092-640X(84)90016-0
    [13]
    SEAH M P.An accurate semi-empirical equation for sputtering yields.Ⅱ:For neon, argon and xenon ions[J].Nuclear Instruments and Methods in Physics Research Section B:Beam Interactions with Materials and Atoms, 2005, 229(3):348-358.
    [14]
    YAMAMURA Y.Contribution of anisotropic velocity distribution of recoil atoms to sputtering yields and angular distributions of sputtered atoms[J].Radiation Effects, 1981, 55(1-2):49-55. doi: 10.1080/00337578108225465
    [15]
    MALHERBE J B.Sputtering of compound semiconductor surfaces.I.Ion-solid interactions and sputtering yields[J].Critical Reviews in Solid State and Material Sciences, 1994, 19(2):55-127. doi: 10.1080/10408439408244588
    [16]
    DAVIDSE P D, MAISSEL L I.Equivalent dc sputtering yields of insulators[J].Journal of Vacuum Science and Technology, 1967, 4(1):33-36. doi: 10.1116/1.1492514
    [17]
    JORGENSON G V, WEHNER G K.Sputtering studies of insulators by means of Langmuir probes[J].Journal of Applied Physics, 1965, 36(9):2672-2674. doi: 10.1063/1.1714558
    [18]
    CANTAGREL M, MARCHAL M.Argon ion etching in a reactive gas[J].Journal of Materials Science, 1973, 8(12):1711-1716. doi: 10.1007/BF02403521
    [19]
    TU Y Y, CHUANG T J, WINTERS H F.Chemical sputtering of fluorinated silicon[J].Physical Review B, 1981, 23(2):823-835. doi: 10.1103/PhysRevB.23.823
    [20]
    MOGI K, OGIWARA T, SUZUKI M.Sputter etching rate ratio of Si to SiO2 using Mesh-Replica method[J].Journal of Surface Analysis, 2002, 9(4):514-523. doi: 10.1384/jsa.9.514
    [21]
    TARTZ M, HEYN T, BUNDESMANN C, et al.Measuring sputter yields of ceramic materials[C]//Proceedings of the 31st International Electric Propulsion Conference.Fairview Park:ERPS, 2009:IEPC-2009-240.
    [22]
    YALIN A P, SURLA V, FARNELL C, et al.Sputtering studies of multi-component materials by weight loss and cavity ring-down spectroscopy:AIAA-2006-4338[R].Reston:AIAA, 2006.
    [23]
    YALIN A P, RUBIN B, DOMINGUE S R, et al.Differential sputter yields of boron nitride, quartz, and kapton due to low energy Xe bombardment:AIAA-2007-5314[J].Reston:AIAA, 2007.
    [24]
    TONDU T, CHARDON J P, ZURBACH S.Sputtering yield of potential ceramics for Hall effect thruster discharge channel[C]//Proceedings of the 32nd International Electric Propulsion Conference.Fairview Park:ERPS, 2011:IEPC-2011-106.
  • 加载中

Catalog

    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Figures(4)  / Tables(3)

    Article Metrics

    Article views(1073) PDF downloads(441) Cited by()
    Proportional views
    Related

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return