Volume 26 Issue 1
Jan.  2000
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LI Xiao-ming, Lü Shan-wei, GAO Ze-xiet al. FiniteElement Analysis of Temperature Field of PCB and Components[J]. Journal of Beijing University of Aeronautics and Astronautics, 2000, 26(1): 5-7. (in Chinese)
Citation: LI Xiao-ming, Lü Shan-wei, GAO Ze-xiet al. FiniteElement Analysis of Temperature Field of PCB and Components[J]. Journal of Beijing University of Aeronautics and Astronautics, 2000, 26(1): 5-7. (in Chinese)

FiniteElement Analysis of Temperature Field of PCB and Components

  • Received Date: 10 Jun 1998
  • Publish Date: 31 Jan 2000
  • Heat transfer was introduced. The finite-element method (FEM) is used to investigate steady-state two and three-dimensional heat transfer in dual-in-line component and PCB. Two methods are compared through real examples' temperature distribution. And experiments with point test method are done to compare with the results of calculated and results are much in accord with each other. Conclusion is also given that three-dimensional finite-element method is more complex and with it more particular messages could be obtained.

     

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  • [1] Hardisty H,Abboud J.Thermal analysis of a dual-in-line package using the finite-element method[J].IEE proceedings, 1987, 134 PtⅠ(1):675~684. [2]Swager Anne Watson.Thermal images provide reliability clues[J].EDN,1990(1):47,49,50,52,54,56,58. [3]杜则裕,刘继元.工程材料简明手册[M].北京:电子工业出版社, 1995. [4]Ellison Gordon N.Extensions of the closed from method for substrate thermal analyzers to include thermal resistances from source-to-substrate and source-to-ambient[J].IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992,15(5):658~666. [5]John N Funk,Menguc M Pinar, Kaveh A Tagavi,et al.A semi-analytical method to predict printed circuit board package temperatures. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992,15(5):675~684. [6]William M Godfrey, Kaveh A Tagavi, Clifford J Cremers,et al.Interactive thermal modeling of electronic circuit boards[J].IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993,16(8):978~985.
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