Volume 30 Issue 12
Dec.  2004
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Yang Chenglei, Zhang Jun, Liu Fenget al. Analysis of data compression algorithm and its improvement in ATN[J]. Journal of Beijing University of Aeronautics and Astronautics, 2004, 30(12): 1178-1181. (in Chinese)
Citation: Yang Chenglei, Zhang Jun, Liu Fenget al. Analysis of data compression algorithm and its improvement in ATN[J]. Journal of Beijing University of Aeronautics and Astronautics, 2004, 30(12): 1178-1181. (in Chinese)

Analysis of data compression algorithm and its improvement in ATN

  • Received Date: 30 Jun 2003
  • Publish Date: 31 Dec 2004
  • To solve the data compression problem and improve the transmission efficiency in the ATN(aeronautical telecommunication network) mobile communication network, the data packets headers compression algorithm of CLNP(connectionless network layer protocol) is discussed in detail. The relationships of transmission efficiency, compression rate and packet length are given by analyzing compression procedure and capability. Combining ESIS(end system to intermediate system) protocol, an improved header compression algorithm of CLNP data packet is presented in the IDRP(inter-domain routing protocol) routing algorithm. The impression efficiency of packets headers is analyzed and the correlation between impression efficiency and packet length is given. The simulation results showed that the new algorithm could promote the compression efficiency of data packets and transmission efficiency of the network.

     

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  • [1] RFC1144, Compressing TCP/IP headers for low-speed serial links [S] [2]ISO/IEC 8473-1, Information technology protocol for providing the connection- less-mode network service [S] [3]ICAO,Manual of technical provisions for the aeronautical telecommunication network (Doc9705) [S] [4]ISO/IEC 8208, Information technology data communications-X.25 packet layer protocol for data terminal equipment [S] [5]Yang Chenglei, Zhang Jun. Header compression and its application in ATN . In:Albert K Y Lam. Proceedings of the 4th International SEATI 2003 . Hongkong:The Institution of Electrocal Engineering Hongkong, 2003. 157~162
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